His Integrated Approach to Research, Education and Industry Innovations and collaborations Revolutionized Electronics Packaging Field Rao R. Tummala, a researcher and educator who has made seminal contributions to microelectronics packaging and whose educational efforts have defined the field, is being honored by IEEE with the 2011 IEEE Field Award in Components, Packaging and Manufacturing Technologies. IEEE is the world’s largest technical professional association. The award, sponsored by the IEEE Components, Packaging and Manufacturing Technology Society, recognizes Tummala for pioneering and innovative contributions to package integration research, cross-disciplinary education and globalization of electronic packaging. The award will be presented on 2 June 2011 at the IEEE Electronic Components and Technology Conference in Lake Buena Vista, Fla. Electronics packaging deals with enclosing large numbers of integrated circuits in a single module using materials such as metals, plasti...
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