At the 44th Annual Symposium on Microelectronics, IMAPS (International Microelectronics And Packaging Society) announces Lifetime Achievement award to Dr.Tummala R Rao the highest honors the Society can bestow.
Dr. Tummala’s leadership and contributions that are a cornerstone of the microelectronics and electronic packaging industries. Rao is a legend in their community having made valuable and extensive contributions to both packaging technologies and the training of future leaders.
Dr. Rao Tummala is a Distinguished and an Endowed Chair Professor in Electrical and Computer Engineering and in Materials Science and Engineering at Georgia Tech. He is also the Founding Director of an NSF Engineering Research Center (ERC) called the Microsystems Packaging Research Center (PRC) pioneering the Second Law of Electronics (the first being Moore ’s Law) by his System-On-Package (SOP) vision. The PRC is currently the largest and most comprehensive micro-systems packaging research, education and industry collaboration Center involving 200 students and 15 faculty from ECE, ME, ChE and MSE departments, and 40 global companies from the U.S., Europe and Asia. He is also an Eminent scholar for the State of Georgia.
Dr. Tummala has published over 320 technical papers, holds 71 U.S. patents and inventions, and authored the first modern reference book for microsystems packaging in 1988, and the first undergraduate textbook in 2001. He is a fellow of the IEEE, IMAPS, and the American Ceramic Society; a member of the National Academy of Engineering, and was the President of the IEEE-CPMT Society and IMAPS Society. He is a consultant to many of the Fortune 500 electronics companies in the U.S., Europe and Asia