Wednesday, May 25, 2011
Rao R. Tummala, a researcher and educator who has made seminal contributions to microelectronics packaging and whose educational efforts have defined the field, is being honored by IEEE with the 2011 IEEE Field Award in Components, Packaging and Manufacturing Technologies. IEEE is the world’s largest technical professional association.
The award, sponsored by the IEEE Components, Packaging and Manufacturing Technology Society, recognizes Tummala for pioneering and innovative contributions to package integration research, cross-disciplinary education and globalization of electronic packaging. The award will be presented on 2 June 2011 at the IEEE Electronic Components and Technology Conference in Lake Buena Vista, Fla.
Electronics packaging deals with enclosing large numbers of integrated circuits in a single module using materials such as metals, plastics and ceramics. Modern packaging technologies allow for denser circuits and multichip packages that enable ultraminiaturized consumer electronics and ultra-high-performance computing systems. The goal of “Systems on a Package” (SOP) is to provide a module that can sense, communicate, provide power and process information all in a small package. Two paths have emerged over the last three decades for high performance computing and consumer systems—on- chip integration by system- on- chip, and package integration by 2D and 3D multichip modules.
Tummala’s contributions began during his 25-year career at IBM with pioneering inventions such as the industry’s first plasma display and the first (and next three generations of) multichip packaging based on ceramics and polymer-copper thin-film interconnections. His Low-Temperature, Co-fired Ceramic (LTCC) technology resulted in the first 100-chip multichip module. After moving to the Georgia Institute of Technology, Atlanta, Ga., Tummala introduced the SOP concept. SOP provides high functionality in a small size yet at low cost compared to the traditional systems on bulky boards.
At the Georgia Institute of Technology, Tummala provided leadership in making packaging an “academic subject “by means of courses, curricula, textbooks and degrees. His proposal to the National Science Foundation (NSF) in 1993 resulted in the establishment of the first NSF Engineering Research Center in the United States Georgia Institute of Technology, demonstrating for the first time an integrated and comprehensive approach to leading-edge research, cross-disciplinary education and global industry collaborations, and technology transfer programs. Considered the “Bible of Packaging,” his Microelectronics Packaging Handbook (Van Nostrand Reinhold, 1989) defined packaging for the first time and introduced its cross-disciplinary nature of science and technology to the academic community. As president of the IEEE Components, Packaging and Manufacturing Technology Society from 2001 to 2004, Tummala was instrumental in broadening the Society’s global reach.
An IEEE Fellow and IBM Fellow, Tummala is also a member of National Academy of Engineering. He received 16 Technical Innovation Awards and nine Invention Awards from IBM. Other awards include the IEEE David Sarnoff Award, IEEE Third Millennium Medal and IEEE Major Education Medal. He obtained a bachelor’s degree in metallurgy from the Indian Institute of Science, Bangalore, and a doctorate in materials science and engineering from the University of Illinois, Urbana. Tummala is currently an endowed chair professor and director of the 3D Systems Packaging Research Center at the Georgia Institute of Technology.
Sunday, May 15, 2011
The Kony Platform leverages Kony's Write Once, Run Everywhere single application definition for designing, developing, deploying and managing mobile applications. A single application code gives companies the ability to change once, change everywhere, ensuring faster adoption of new operating systems and standards as they are introduced and eliminating maintenance, upgrade and future development costs.
"We're honored that such a prestigious organization as the American Business Awards considers us one of the nation's most innovative companies this year," said Raj Koneru, CEO of Kony. "We pride ourselves on our novel approach to a burgeoning industry; we are constantly innovating and adapting to the ever evolving mobile market."
More than 2,800 nominations from organizations of all sizes and in virtually every industry were submitted this year for consideration in more than 40 categories, including Most Innovative Company of the Year, Management Team of the Year, Best New Product or Service of the Year, Corporate Social Responsibility Program of the Year, and Executive of the Year.
Saturday, May 14, 2011
1. K.GOPALSAMY, Rajapalayam - AIADMK
1) T.K.M Chinnayya: Minister for Backward Classes and Environment
2) B.V Ramana: Minister for Handlooms and Textiles
Thursday, May 12, 2011
Chandra Sekhar Sakhamuri, a native of Veerapuram village in Piduguralla mandal, secured 24th rank. He hails from an agricultural family. He is an MCA degree holder.
Kolasani Venkata Subbaiah Chowdary,a native of Chilumuru village near Tenali, made the district proud by securing 26th rank.
He is currently undergoing training in Indian Revenue Service as Assistant Commissioner of Income Tax at Nagpur.
He is an alumnus of Sri Rama Rural Educational Institutions, Chilumuru. Mr. Chowdary is the grandson of K.V.S. Chowdary, who was the founder of Sri Rama Educational Institutions (established in 1949).
Both Harikrishna (Elo 2666) and Harika (2520) tallied 6.5 points in nine Swiss League rounds in the championship being played in Iran. No. 4 seed Harikrishna clinched the issue in a three-way tie-break with China's Ya Yangyi and Vietnam's Nguyen Ngoc Truong Son. International Master (IM) and top seed Harika was a clear winner - she finished half a point ahead of Pham Le Thao Nguyen ( Vietnam).
Saturday, May 7, 2011
The report stated that ICVL was looking at 24% stake in the MEC Coal for about US$200 mn.
Through its subsidiary PT Tekno Orbit Persada, MEC Coal is developing two coal mines in Indonesia's East Kalimantan, with an estimated reserves of 1.5-2 billion tonnes, says report.
“We have an agreement to give additional land if they accomplish the 100,000 hectares within two years,” Esayas Kebede, head of the ministry’s land investment support directorate, said in a phone interview today from Addis Ababa, the capital.
On April 29, Esayas said the government in November reduced Karuturi’s concession by two-thirds from 300,000 hectares because the area was too large for a single company to manage and to allow for an annual migration of antelope in southwestern Ethiopia. Karuturi yesterday denied the concession had been reduced.
“The information seemed to be baseless because Karuturi has not received any legal letter about the reduction from the Ethiopian government,” Niladri Mondal, a spokesman for Karuturi, said by phone from Mumbai today. “If a letter had been given, we would have taken it into consideration.”
Karuturi’s lease agreement, published on the ministry’s website, says the company will receive an additional 200,000 hectares if it develops the plot adequately within the specified period.
Karuturi, which has invested $100 million in Ethiopia so far, plans to have 65,000 hectares in production this year and sell its first harvest in October mainly within Ethiopia and to other East African nations, Chief Executive Officer Sai Ramakrishna Karuturi said in an e-mailed statement in February. The company is growing crops including rice, palm oil, sugar cane and cereals.
Tuesday, May 3, 2011
The Kupfer Award was first presented in 1993 to Carl Kupfer, MD, who served as Director of the National Eye Institute, U.S. National Institutes of Health, for 30 years. This award is honors those who have demonstrated distinguished public service on behalf of eye and vision research.
The Association for Research and Vision in Ophthalmology (ARVO) is the largest eye and vision research organization in the world. Members include more than 12,500 eye and vision researchers from over 80 countries. ARVO encourages and assists research, training, publication and knowledge-sharing in vision and ophthalmology.