Tuesday, June 2, 2009

Professor Rao Tummala to present at 2009 International Wafer-Level Packaging Conference

The SMTA and Chip Scale Review announce that Professor Rao Tummala will be the keynote speaker at the 6th Annual International Wafer-Level Packaging Conference being held October 27-30, 2009 at the Santa Clara Marriott Hotel in Santa Clara, California.

Prof. Rao Tummala is a Distinguished and Endowed Chair Professor, and Founding Director of NSF ERC at Georgia Tech, the largest Academic Center in Microsystems pioneering System-On-Package (SOP) vision, since 1994. Prior to joining Georgia Tech, he was an IBM Fellow, pioneering such major technologies as the first plasma flat panel display based on gas discharge, the first and next three generations of multichip packaging based on 35-layer alumina and 61-layer LTCC with copper and copper-polymer thin film, and materials for ink-jet printing and magnetic storage.

Prof. Tummala has published 426 technical papers, holds 74 patents and inventions; authored the first modem packaging reference book-Microelectronics Packaging Handbook (Van Nostrand, 1988) and the first undergrad textbook-Fundamentals of Microsystems Packaging (McGraw Hill, 2001) and first book introducing the System-On-Package technology. He is a Fellow of IEEE, IMAPS, and the American Ceramic Society, and member of the National Academy of Engineering in USA and in India. He was the President of both IEEE-CPMT and the IMAPS Societies.
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